Osram Opto Semiconductors recently began to work with Polish 3D-printing company XTPL to initiate evaluation of adopting 3D printing technology solutions to address the challenges connected with the manufacture of future generations of lighting elements.
Osram signed an agreement with XTPL last month to access the possibility of implementing XTPL’s technology in Osram’s production processes for create conductive interconnections for semiconductors. The technology, according to XTPL, is similar to the solution developed for repairing open defects in displays and the smart glass industry. Osram and XTPL are now collaborating at the proof of concept stage based on previous results.
The technology of XTPL can add conductive structures on the individual micron scale (1-8 µm) without using electric fields, which fully eliminates the risk of damage to the substrate and other electrically active components.