Many European readers are coming back from holidays—I hope you had a grand time. For those just now going on their holidays, I hope you will have a refreshing time. The new year will be busy and difficult for us all with so many innovations coming and competing, notably the parallel development of four different techniques to achieve ADB. So, we’ve decided to present in detail these four techniques.
We are starting this week with µAFS (see next). This technology—developed by Osram, Infineon, Hella, Daimler, and Fraunhofer under the German research association funded by the Federal Ministry of Education and Research—has achieved the basis for an intelligent LED vehicle headlamp with high resolution.
The µAFS technology leads to a further increasing headlamp complexity with more than 1,000 pixels vs Matrix with less than 20 segments, or LED Pixel Board Mercedes E Class with 84 LEDs.
The µAFS chip, called EVIYOS by OSRAM, contains 1,024 pixels with a total flux of 3,000Lm for an energy consumption of 30W.
Each pixel is individually addressable and emits 3Lm at 11mA
In this week’s exclusive interview, Claus Allgeier, in charge of automotive OEM business & technology development at Osram, reveals that he expects a prototype will be presented at the DVN Munich workshop to be held this coming 30–31 January, and series production will start in 2020.