Bosch invested €600m for a new wafer fabrication in Reutlingen. Worldwide it is the biggest such investment for the Bosch Group. The new facility is capable of 200 millimetre semiconductors (current limitation is 150) predominantly for use in airbag controls, ABS, EPS, motor management and driver assistance.
Bosch is responding to the trend that the $300 worth of semiconductors in the average vehicle will continue to grow in the future.
The new plant is capable of churning out 1000 silicon wafers a day.
It is expected that by 2012, 800 new jobs will be created in the area.